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		Electronics Manufacturing with Lead Free Halogent Free and Conductive Adhesive Materials by Lau, John H [author] Lee, Ning Cheng [author] Wong, C. P [author] Material type: Text Language: English Publication details: New York : McGraw-Hill, c2003 Online access: Table of Contents Availability: Items available for loan: Reference Section (1)Location, call number: Reference Section 621.381 LAU.
		Development of Reworkable Underfili from Hybrid Composite of Free Radical Polymerization System by Fan, lianhua Wong, C. P Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Study on Effect of Coupling Agents on Underfili Material in Flip Chip Packaging by Luo, Shijian Wong, C. P Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effect of Uv/Ozone Treatment on Surface Tension and Adhesion in Electronic Pakaging by Luo, Shijian Wong, C. P Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Development of No-Flow Underfili Materials for Lead-Free Solder Bumped Flip-Chip Applications by Zhang, Z Shi, S. H Wong, C. P Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Recent Advances in Plastic Packaging of Flip Chip and Multichip Modules Mcm of Microelectronics by Wong, C. P Wong, Michelie M Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Study OfFluxing Agent Effects onProerties of No-Flow Underfili Materials for Flip-Chip Applications by Shi, S. H Wong, C. P Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effective Elastic Modulus of Underfili Material for Flip-Chip Applications by Qu, Jianmin Wong, C. P Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		High Performance No-Flow Underfilis for Low-Cost Flip-Chip Application Material Characterization by Wong, C. P Shi, Songhua H Jefferson, G Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		An Overviw and Evaluation of Anistropicaliy Conductive Adhesive Films for Fine Pitch Electronic Assembly by Chang, David C Mcbride, Graham B Wong, C. P Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Accelerated life Test of Z-Axis Conductive Adhesives by Chang, D. D Fulton, J. A Wong, C. P Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		High Performance Screen Printable Silicone as Selective Hybrid Ic Encapsulant by Wong, C. P Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Index-Matching Elastomers for Fiber Optics by Wong, C. P Filas, Robert W Johnson, Bertrand H Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Surface Property of Passivation Layer on Integrated Circuit Chip and Solder Mask Layer on Printed Circuit Board by Luo, Shijian Wong, C. P Source: Ieee Transactions onElectronics Packaging Manufacturing Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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