Your search returned 3 results.

Results
		Hardware / Software Codesign of Finite Field Datapath for low-Energy Reed -Solomon Codecs. by Nishitani, T Song, L Parhi, K. K Source: Ieee Transactions on Very Large Scale Intergration (Vlsi) Systems Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Three Dimensional Coupled Thermal Stress in Infinite Plate Subjected to A Moving Heat Source. by Tsuji, M Nishitani, T Shimizu, M Source: The Journal of Strain Analysis for Engineering Design Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Simple Creep Relation for A Polymer That IncludesEffect of Back Stress. by Suetsugu, M Tsuji, M Nishitani, T Source: The Journal of Strain Analysis for Engineering Design Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

Refine your search