A Comprehensive Approach for Analysis of Package Induced Stress in Ic'S Using Analytical and Empirical Methods

By: Material type: ArticleArticleDescription: 870-873 pSubject(s): In: IEEE Transactions on Components Hybrids and Manufacturing Technology
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Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.14, No.04 (Dec. 1991) Available

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