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		High Mechanical Reliability of Back-Ground Gaas Lsi Chips with Low Thermal Resistance by Nishiguchi, Masanori Goto, Noboru Nishizawa, Hideaki Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Highly Reliable Au-Sn Eutectic Bonding with Background Gaas Lsi Chips by Nishiguchi, Masanori Nishizawa, Hideaki Goto, Noboru Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Multichip Packaged Gaas 16x16 Paraliel Multiplier by Sekiguchi, T Hirose, T Nishiguchi, Masanori Sawada, Sosaku Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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