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Thermal Stress Analysis of Tape Automated Bonding Packages and Interconnections by
  • Lau, John H
  • Harkins, Girvin
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Stiffness of `Guli-Wing' Leads and Solder Joints for a Plastic Quad Flat Pack by
  • Lau, John H
  • Harkins, Girvin
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Request article
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