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Cosintering Process for Glass-Ceramic/Copper Multilayer Ceramic Substrate by
  • Master, Raj N
  • Tummala, Rao R
  • Herron, L. Wynn
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Device Interconnection Technology for Advanced Thermal Conduction Modules by
  • Master, Raj N
  • Beckham, Keith F
  • Ray, Sudipta K
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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