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Rigorous Electromagnetic Modeling of Chip-To-Package First-Level Interconnections by
  • Tsuei, Y. G
  • Cangeliaris, andreas C
  • Prince, John L
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Extraction of Normal Modes from Contaminated Measurement with Noise for Highly Coupled Structures. by
  • Tsuei, Y. G
  • Chen, S. Y
  • Ju, M. S
Source: Transactions ofAsme, Journal of Vibration and Acoustics
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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