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		High Thermal Conductivity Aluminum Nitride Ceramic Substrates and Packages by Iwase, Nobuo Tsuge, Akihiko Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Titanium Nitride-Molybdenum Metalilzing Method for Aluminum Nitride by Asai, H Iwase, Nobuo Sato, H Kimura, K Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Solder Bumper Formation Using Electroless Plating and Ultrasonic Soldering by Inaba, Michihiko Yamakawa, Koji Iwase, Nobuo Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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