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Enhancement of Flip-Chip Fatigue life by Encapsulation by
  • Suryanarayana, Darbha
  • Mccreary, Jack M
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Flip-Chip Soldering to Bare Copper Circuits by
  • Ingraham, Anthony P
  • Mccreary, Jack M
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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