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		High-Yield Flip-Chip Bonding and Packaging of Low-Threshold Vcsel Arrays on Sapphire Substrates by Liu, A Taylor, Thomas Horst, P Source: AATCC Review Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Failure Model for Composite Materials Under Quasi-Static Crushing Conditions by Horst, P Morthorst, M Source: The Journal of Strain Analysis for Engineering Design Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effective Stiffness of Postbuckled Stiffened Metallic Panels Under Combined Compression and Shear Stress by Heitmann, M Horst, P Source: The Journal of Strain Analysis for Engineering Design Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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