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		Simultaneous Switching Noise: Influence of Plane-Plane and Plane-Signal Trace Coupling by Vaidyanath, Arun Prince, John L Cangeliaris, andreas C Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Sso Noise Electrical Performance limitations for Pqfp Packages by lin, L Prince, John L Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Per-Unit-Length Capacitance Matrix of Flaring Vlsi Packaging Interconnections by Omer, Ahmed Cangeliaris, andreas C Prince, John L Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Rigorous Electromagnetic Modeling of Chip-To-Package First-Level Interconnections by Tsuei, Y. G Cangeliaris, andreas C Prince, John L Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Computation of Transients in Lossy Vlsi Packaging Interconnections by liao, J. C Prince, John L Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Frequency-Dependent Inductance and Resistance Calculation for Three-Dimensional Structures in High-Speed Interconnect Systems by Cangeliaris, andreas C Prince, John L Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Simulation of Transients in Vlsi Packaging Interconnections by liao, J. C Prince, John L Cangeliaris, andreas C Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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