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Advanced Copna-Resin as a Low Temperature Curing Resin for High-Density Electronic Packages by
  • Nawa, Kazunari
  • Ueda, Sakae
  • Watanabe, Hideyuki
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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A Nwe Approach to Acoustic Signal Monitoring Based onGeneralized Propbabilistic Descent Method. by
  • Watanabe, Hideyuki
  • Tanaka, Satoru
  • Matsumoto, Yuji
Source: Ieee Transactions on Signal Processing
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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