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		Numerical Stress Analysis of Resin Cracking in Lsi Plastic Packages Under Temperature Cyclic Loading by Saitoh, Takehiro Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Numerical Stress Analysis of Resin Cracking in Lsi Plastic Packages Under Temperature Cyclic Loading. II. Using Alioy 42 as Leadframe Material by Saitoh, Takehiro Toya, Masayuki Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		linear Fracture Mechanics Analysis on Growth of Interfacial Delamination in Lsi Plastic Packages Under Temperature Cyclic Loading by Saitoh, Takehiro Matsuyama, Hidehito Toya, Masayuki Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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