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		Concirrent Packaging Architecture Design by Krusius, J. Peter Cao, lipeng Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Package Thermal Resistance: Geometrical Effects in Conventional and Hybrid Packages by Pence, Wililam E Krusius, J. Peter Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Physical Design Alternatives for Risc Workstation Packaging by O'Brien, D. E Krusius, J. Peter Hahne, B. M Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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