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Cu/Photosensitve-Bcb Thin-Film Multilayer Technology for High-Performance Multichip Modules by
  • Shimoto, Tadanori
  • Utsumi, K
  • Matsui, K
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Cluster Analysis for Optimal Sampling of Traffic Count Data: Air Quality Example by
  • Nie, X
  • Utsumi, K
Source: Asce: Journal of Transportation Engineering
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Bit-Error Rate of M-Qam Signal and Its Analysis Model for Composite Distorations in Am/Qam Hybrid Transmission. by
  • Maeda, K
  • Utsumi, K
Source: Ieee Transactions on Communications
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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