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		Junction Temperature Considerations in Evaluating Electronic Parts for Use Oputside Manufacturers Specified Temperature Ranges by Condra, lioyd Das, Diganta Pecht, Michael G Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Evaluation of Manufacturing Variables InReliability of Surface Mount Capacitors by Condra, lioyd Christou, Aris Johnson, Grant M Pecht, Michael G Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Comparison of Plastic and Hermetic Microcircuits Under Temperature Cycling and Temperature Humidity Bias by Condra, lioyd Freedman, Tim Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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