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		Immersion-Cooled Heat Sinks for Electronices Insight from High Speed Photography by Bhavnani, Sushil H Jaeger, Richard C Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effect of Channel Width on Pool Boiling from a Microconigured Heat Sink by Noweli, Ronald M Bhavnani, Sushil H Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Re-Entrant Cavity Surface Enhancements for Immersion Cooling of Silicon Multichip Packages by Goodling, John S Jaeger, Richard C Goyal, A Bhavnani, Sushil H Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Classroom ofFuture: An Internet-Delivered National Course on Thermal Management ofElectronics. by Bhavnani, Sushil H Joshi, Yogendra K Bar-Cohen, Avram Source: Journal of Engineering Education Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effect of Surface Geometry and Orientation on Laminar Natural Convection Heat Transfer from a Vertical Flat Plate with Transverse Roughness Elements by Bhavnani, Sushil H Bergles, Arthur E Source: International Journal of Heat and Mass Transfer Material type: Article; Format: print Online access: Click here to access online Availability: Items available for loan: Periodical Section (1). Request article

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