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		Effect of Nonconduction Filier Additions on Aca Properties andReliability of Aca Flip Chip on Organic Substrates by Yim, Myung-Jin Paik, Kyung-Wook Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Exothermic Reaction Induced Eutectic Pb-Sn Solder Bali Melting InUnderfili Curing Process by Kwon, Woon-Seong Jang, Se-Young Paik, Kyung-Wook Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Effect OfOxidation of Cu-Base Leadframe onInterface Adhesion Between Cu Metal and Epoxy Molding Compound by Cho, Soon-Jin Paik, Kyung-Wook Kim, Yong-Ju Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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