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		Investigation OfUnderfili Delamination and Cracking in Filp Chip Modules Under Temperature Cyclic Loading by Fan, X-J lim, T. B Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Three-Dimensional Modeling of Wire Sweep Incorporating Resin Cure by Wu, J H Tay, A. A. O lim, T.B Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Compact Ultra-Wideband Bandpass Filter Using Harmonic-Suppressed Multiple-Mode Resonator by Lim, T.B Source: IET:IEE: Electronics Letters Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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