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Laplace-Trans forms and Fast-Repair Approximations for Multiple Availability and its Generalizations by
  • Finkelstein, Maxim
  • Zarudnij, Vladimir
Source: IEEE Transactions on Reliability
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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A Test Chip Design for Detecting Thin-Film Cracking in Integrated Circuits by
  • Chen, Kua L
  • Zarudnij, Vladimir
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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