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		The Conceivable Accuracy of Experimental and Numerical Thermal Analyses of Electronic Systems by Lasance, C. J. M Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Two Benchmarks to FacilitateStudy of Compact Thermal Modeling Phenomena by Lasance, C. J. M Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Chalienges in Thermal Modeling of Electronics AtSystem Level Summary of Panel Held AtTherminic 2000 by Lasance, C. J. M Rantala, J.T Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Influence of Various Common Assumptions onBoundary Condition Independence of Compact Thermal Models by Lasance, C. J. M Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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