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Development of Reworkable Underfili from Hybrid Composite of Free Radical Polymerization System by
  • Fan, lianhua
  • Wong, C. P
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Adhesive Evaluation on Low-Cost Alternatives to Thermosetting Epoxy Encapsulants by
  • Fan, Lianhua
Source: Ieee Transactions onElectronics Packaging Manufacturing
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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