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		Microvias for Low Cost High Density Interconnects by Lau, John H [author] Lee, S. W. Ricky [author] Series: McGraw-Hill Professional Engineering Material type: Text Language: English Publication details: New York : McGraw-Hill, c2001 Online access: Table of Contents Availability: Items available for loan: Circulation Section (1)Location, call number: Circulation Section 621.381046 LAU.
		Low Cost Flip Chip Technologies for Dca Wlcsp and Pbga Assemblies by Lau, John H [author] Material type: Text Language: English Publication details: New York : McGraw-Hill, c2000 Online access: Table of Contents Availability: Items available for loan: Circulation Section (1)Location, call number: Circulation Section 621.381046 LAU.
		Electronics Manufacturing with Lead Free Halogent Free and Conductive Adhesive Materials by Lau, John H [author] Lee, Ning Cheng [author] Wong, C. P [author] Material type: Text Language: English Publication details: New York : McGraw-Hill, c2003 Online access: Table of Contents Availability: Items available for loan: Reference Section (1)Location, call number: Reference Section 621.381 LAU.
		Characterization of Underfili Materials Foer Functional Solder Bumped Flip Chips on Board Applications by Lau, John H Chang, Chris Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effects of Build-Up Printed Circuit Board Thickness onSolder Joint Reliability of a Wafer Level Chip Scale Package (Wlcsp) by Lau, John H Lee, S-W Ricky Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Electrical Design of a Cost-Effective Thermal Enhanced Plastic Bali Grid Array Package-Nubga by Lau, John H Chou, Tai-Yu Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Stress Analysis of Tape Automated Bonding Packages and Interconnections by Lau, John H Harkins, Girvin Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Stiffness of `Guli-Wing' Leads and Solder Joints for a Plastic Quad Flat Pack by Lau, John H Harkins, Girvin Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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