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		Efficient Design Using Fuzzy Logic Based Regression Models by Schaible, Brian Lee, Yung-Chang Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Modeling and Experimental Studies on Thermosonic Flip-Chip Bonding by Kang, Sa-Yoon Wiliams, Paul M Lee, Yung-Chang Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Fuzzy Logic Models for Ranking Process Effects by Schaible, Brian Xie, Hong Lee, Yung-Chang Source: IEEE Transactions on Fuzzy Systems Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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