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		Microelectronic Circuit Design by Jaeger, Richard C [author] Blalock, Travis N [author] Series: Electronics and VLSI Circuits Edition: 3rd Material type: Text Language: English Publication details: Boston : McGraw-Hill, c2008 Online access: Table of Contents Availability: Items available for loan: Circulation Section (1)Location, call number: Circulation Section 621.3815 JAE.
		Microelectronic Circuit Design by Jaeger, Richard C [author] Series: McGraw-Hill Series in Electrical and Computer Engineering Material type: Text Language: English Publication details: New York : McGraw-Hill, c1997 Online access: Table of Contents Availability: Items available for loan: Circulation Section (1)Location, call number: Circulation Section 621.3815 JAE. Reference Section (1)Location, call number: Reference Section 621.3815 JAE.
		Immersion-Cooled Heat Sinks for Electronices Insight from High Speed Photography by Bhavnani, Sushil H Jaeger, Richard C Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Substrate Thickness Optimization for liquid Immersion Cooled Silicon Multichip Modules by Azimi, Mehidi Jaeger, Richard C Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Packaging Technology for a Low Temperature Astrometric Sensor Array by Johnson, R. Wayne Jaeger, Richard C Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Off-Axis Sensor Rosettes for Measurement OfPiezoresistive Coefficients of Silicon by Jaeger, Richard C Carey, Malachy Johnson, R. Wayne Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Re-Entrant Cavity Surface Enhancements for Immersion Cooling of Silicon Multichip Packages by Goodling, John S Jaeger, Richard C Goyal, A Bhavnani, Sushil H Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Heat Sink Optimization with Application to Microchannels by Knight, Roy W Hali, D.J Goodling, John S Jaeger, Richard C Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Evaluation of Piezoresistive Coefficient Variation in Silicon Stress Sensors Using a Four-Point Bending Test Fixture by Jaeger, Richard C Johnson, R. Wayne Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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