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		Practical Guide to the Packaging of Electronics Thermal and Mechanical Design and Analysis by Jamnia, Ali [author] Edition: 2nd Material type: Text Language: English Publication details: Boca Raton, Fl : CRC Press, c2009 Online access: Table of Contents Availability: Items available for loan: Circulation Section (1)Location, call number: Circulation Section 621.381046 JAM.
		High Temperature Electronics by Mccluskey, F. Patrick [editor] Grzybowski, Richard [editor] Podlesak, Thomas [editor] Series: Electronic Packaging Series Material type: Text Language: English Publication details: Boca Raton : CRC Press, c1997 Online access: Table of Contents Availability: Items available for loan: Circulation Section (1)Location, call number: Circulation Section 621.381 MCC.
		Electronic Techniques Shop Practices and Construction by Villanucci, Robert S [author] Autgis, Alexander W [author] Megow, William F [author] Edition: 4th Material type: Text Language: English Publication details: Englewood Cliffs, Nj : Printice-Hall, c1991 Online access: Table of Contents Availability: Items available for loan: Circulation Section (1)Location, call number: Circulation Section 621.381046 VIL.
		Surface Mount Technology for Concurrent Engineering and Manufacturing by Classon, Frank [author] Series: Electronic Packaging and Interconnection Series Material type: Text Language: English Publication details: New York : McGraw-Hill, c1993 Online access: Table of Contents Availability: Items available for loan: Circulation Section (1)Location, call number: Circulation Section 621.381531 CLA.
		Computational Parameter Study of Chip Scale Package Array Cooling by Watson, Sean P Murray, Bruce T Sammaki, Bahgat G Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Novel Approach ToDesign of Complex Heat Transfer Systems Portable Computer Design a Case Study by Shidore, SARang Adams, Vance Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Interfacialfracture Toughness for Delamination Growth Prediction in a Novel Peripheral Array Package by Sundararman, Viswanthan Sitaraman, Suresh K Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Modular, Device-Scale, Direct-Chip Attach Packaging for Microsystems by Neysmith, Jordan Baldwin, Daniel F Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Reliability Evaluations of Under Bump Metaliurgy in Two Solder Systems by Guo, Yifan Zhang, Chales Kuo, Shun-Meen Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Wire-Bond Void Formation During High Temperature Aging by Chang, Hen Hsieh, Ker-Chang Yang, Albert Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Automated Design Tool for Examining Mictoelectonic Packagin Desugbn Altermatives by Chin, Siew-Wei Rajan, Subramaniam D Nagaraj, Krishnaswamy Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Restraint Effects in Laser Welding of an Aluminum Mmc by Fuerschbach, P. W Cieslak, M. J Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		onPositive Temperature Dependence OfThermal Conductivity of a Diamond-Based Heat Sink Paste by Hasselman, D. P. H Dobaldson, Kimberly Y Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermaliy Conductive Polymer Composites for Electronic Packaging by Lu, X Xu, G Source: Journal of Applied Polymer Science Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Optimization of High Pin Count Cavity Up Enhanced Plastic Bali Grid Array (Epbga) Packages for Robust Design by Mertol, Atila Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Testability and Signal Integrity in a Low Cost Multichip Module by Omer, Ahmed Flint, andrew Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Sso Noise Electrical Performance limitations for Pqfp Packages by lin, L Prince, John L Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Corrosion Criteria for Electronic Packaging. I-A Framework for Corrosion of Integrated Circuits by Hoge, Carl E Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Corrosion Criteria for Electronic Packaging. II. Calculated Corrosion Currents and Acceleration Factors by Hoge, Carl E Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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