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		Multichip Mmic Package for X and Ka Bands by Decker, D. Richard Mysoor, Barayan Rangappa Tatikola, Ramani Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		An Expert for Veriation ofAuxilary Transmisssion-Line Method to Evaluate A Microwave Thermal Noise Source by Nakano, Hiroshi Source: Ieee Transactions on Instrumentation and Measurement Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Microwave Penetration Depth Measurement for High Tc Superconductors By Dielectric Resonators by Lue, H.T Lue, J T Tseng, T Y Source: Ieee Transactions on Instrumentation and Measurement Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Microstrip Patch Sensor for Measurement ofPermittivity of Homogeneous Dielectric Materials. by Bogosanovich, M Source: Ieee Transactions on Instrumentation and Measurement Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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