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Application of Ai/Pi Composite Bumps to Cog Bonding Process by
  • Jeng, Jen--Huang
  • Hsieh, T. E
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Advanced Low-Cost Bare-Die Packaging Technology for liquid Crystal Displays by
  • Hwang, Jackson C
Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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