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		An Experimental Investigation Into Soft-Pad Grinding of Wire-Sawn Silicon Wafers by Pei, Z J Source: International Journal of Machine tools & Manufacture: Design, Research and Application Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Finite Element Analysis for Grinding of Wire-Sawn Silicon Wafers: A Designed Experiment by Pei, Z J Source: International Journal of Machine tools & Manufacture: Design, Research and Application Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Study on Surface Grinding of 300 Mm Silicon Wafers by Pei, Z J Source: International Journal of Machine tools & Manufacture: Design, Research and Application Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Fine Grinding of Silicon Wafers: Designed Experiments by Pei, Z J Strasbaugh, Alan Source: International Journal of Machine tools & Manufacture: Design, Research and Application Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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