Results of search for 'ccl=su:"Bonding"' › Engr Abul Kalam Library catalog

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		Ir Microscopic Observation of Plastic Coated Tab Inner Lead Bonds Degrading During Thermal Cycling by Alpern, Peter Tilgner, Rainer Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Stress Analysis of Tape Automated Bonding Packages and Interconnections by Lau, John H Harkins, Girvin Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Inner Lead Bonding Technique for 500-Lead Dies Having a 90-Um Lead Pitch by Atsumi, Koichiro Kashima, Noriyasu Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Direct Chip Interconnect Using Polymer Bonding by Gilieo, Ken Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A New Bonding Technology Using Gold and Tin Multilayer Composite Structures by Lee, Chin C Wang, Chen Y Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Bonding Technique for Thin Gaas Dice with Via Holes Using Gold-Tin Composites by Wang, Chen Y Lee, Chin C Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Highly Reliable Au-Sn Eutectic Bonding with Background Gaas Lsi Chips by Nishiguchi, Masanori Nishizawa, Hideaki Goto, Noboru Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Improvements in Wire Bonding and Solderability of Surface Mount Components Using Plasma Cleaning Techniques by Rust, Ray D Doane, Daryl Ann Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Development of Copper Wire Bonding Application Technology by Fujita, Kazuya Maeda, Takamichi Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Transmission Electron Microscopy Study of Ultrasonic Wire Bonding by Krzanowski, James E Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Bonding Mechanism Between Aluminum Nitride Substrate and Ag-Cu-Ti Solder by Kurihara, Yasutoshi Takahashi, Shigeru Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Experimental Study and Modeling ofSalt Effect on Phase Equilibria for Binary Hydroxylic Liquid Systems by Ghizellaoui, S Meniai, A H Source: Desalination Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Failure Behavior and Separation Criterion for Strengthened Concrete Members with Steel Plates by Oh, Byung Hwan Park, Dae Gyun Source: Asce: Journal of Structural Engineering Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Chemical Bonding Characteristics and Dielectric Properties of Nd2(Ba1-X Srx)Zno5 Solid Solutions by Kan, Akinori Source: Journal of Materials Research Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Challenges in Mems Applications: Phase Change Phenomena and Thermal Bonding Processes by Lin, Liwei Source: Microelectronics Journal Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Internal Re for ming Solide Oxide Fuel Cell Gas Turbine Combined Cycles (Irsofc-Gt)-Part Ii: Energy and Thermoeconomic Analysis by Massardo, A.F Source: Transactions ofAsme, Journal of Engineering for Gas Turbines and Power Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Bonding of Silicon Nitride Ceramic Composites with Mixtures by Zhou, E. Z Source: Journal of Materials Research Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Optimal Wire-Sizing Function UnderElmore Delay Model with Bounded Wire Sizes by Lee, Y. M Source: Ieee Transactions on Circuits and Systems, I: Fundamental Theory and Applications Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Support Srong for Us Show by F A, Pintar Source: International Dyer Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Experimental Study on Shear Splitting Failure of Full-Scale Composite Concrete Encased Steel Beams by Weng, C.C Source: Asce: Journal of Structural Engineering Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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Your search returned 99 results.