Results of search for 'ccl=an:53955' › Engr Abul Kalam Library catalog

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		Experimental Design Considerations for Accelerated life Tests with NOnlinear Constraints and Censoring by Monroe, Eric M Pan, Rong Source: Journal of Quality Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Enhanced Electronic System Reliability Chalienges for Temperature Prediction by Parry, John O Rantala, Juha T Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Effect of Power Cycling onReliability of Lead-Free Surface Mount Assembies by Davitt, Elaine Stam, Frank A Barrett, John Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effect of Nonconduction Filier Additions on Aca Properties andReliability of Aca Flip Chip on Organic Substrates by Yim, Myung-Jin Paik, Kyung-Wook Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Reliability Evaluations of Under Bump Metaliurgy in Two Solder Systems by Guo, Yifan Zhang, Chales Kuo, Shun-Meen Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Cycling Analysis of Flip-Chip Solder Joint Reliability by Pang, John H. L Chong, D. Y. R Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Dielectric Breakdown Mechanism of Thin-Sio2 Studied byPost-Breakdown Resistance Statistics by Satake, Hideki Toriumi, Akira Source: IEEE Transactions on Electron Devices Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Reliability and Social Policy by Golomski, Wililam A. J Source: IEEE Transactions on Reliability Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Novel Flip Chip Technology Using Nonconductive Resin Sheet by Ito, Satoshi Mizutani, Masaki Kuwamura, Makoto Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Reliable and Environmentaliy Friendly Packaging Technology Flip Chip Joining Using Anisotropicaliy Conductive Adhesive by liu, Johan Malmodin, Jens Lai, Zonghe Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Probabilistic Analysis of Peak Response of Mdof Systems with Uncertain Psd Function by Hong, H P Wang, S S Source: Earthquake Engineering and Structural Dynamics Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Control Design for Seismicaliy Excited Buildings: Sensor and Actuator Reliability by Alt, T. R Jabbari, F Yang, J. N Source: Earthquake Engineering and Structural Dynamics Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Wire-Bond Void Formation During High Temperature Aging by Chang, Hen Hsieh, Ker-Chang Yang, Albert Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Assessmaent of Glass-Metal Composition Plasma Displauy Planels Using Design of Experiments by Lee, Mikyoung Pecht, Michael G Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Mechanicbased Solution to Rf Mems Switch Stictch Stiction Problem by Mercado, P. E Lee, Tien-Yu Tom Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Statistical Performance Analysis of Seismic-Excited Structures with Active Interaction Control by Zhang, Yunfeng Iwan, Wilfred D Source: Earthquake Engineering and Structural Dynamics Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Commentary: Author Reply to a Book Review by Birolini, Alessandro Source: IEEE Transactions on Reliability Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Failure Mechanism Study of Anisotropic Conductive Film (Acf) Packages by Mercado, Lei L White, Jerry SARihan, Vijay Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		onReliability of Electronic Payment Systems by anderson, Ross J Bezuidenhoudt, Johann Source: IEEE Transactions on Software Engineering Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Reliability Studies of Surface Mount Solder Joints - Effect of Cu-Sn Intermetalilc Compounds by So, Alex C. K Chan, Yan C Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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