Kaulfersch, Eberhard Vogel, Dietmar Michel, Bernd <br/><br/>
Microde for mation Analysis of Packages and Interconnects to Improve Finite Element Models  for  Reliability Assessments 

 - 239-244 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Csp<br/>Fea<br/>Cte