Kurihara, Yasutoshi Takahashi, Shigeru <br/><br/>
Bonding Mechanism Between Aluminum Nitride Substrate and Ag-Cu-Ti Solder 

 - 361-368 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Bonding<br/>Aluminum Nitride<br/>Damage Mechanisms