TY  - SER
AU  - Hayashi, Tsuyoshi
AU  - Katsura, Kohsuke
AU  - Tsunetsugu, Hideki
TI  - A New Packaging Technology Using Micro-Solder Bumps  for  High-Speed Photoreceivers
KW  - Packaging Technology
KW  - Bumps
KW  - High-Speed Photoreceivers
ER  -