Hayashi, Tsuyoshi Katsura, Kohsuke Tsunetsugu, Hideki <br/><br/>
A New Packaging Technology Using Micro-Solder Bumps  for  High-Speed Photoreceivers 

 - 578-582 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Packaging Technology<br/>Bumps<br/>High-Speed Photoreceivers