Pan, Tsung-Yi <br/><br/>
Thermal Cycling Induced Plastic Deformation in Solder Joints. II. Accumulated Deformation in through Hole Joints 

 - 824-832 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Thermal Cycle Stability<br/>Plastic Deformation<br/>Solder Joint Reliability