Goodling, John S. Jaeger, Richard C. Goyal, A. Bhavnani, Sushil H. <br/><br/>
Re-Entrant Cavity Surface Enhancements  for  Immersion Cooling of Silicon Multichip Packages 

 - 815-822 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Re-Entrant Flows<br/>Cavity<br/>Immersion