TY  - SER
AU  - Tsuei, Y. G
AU  - Cangeliaris, andreas C.
AU  - Prince, John L.
TI  - Rigorous Electromagnetic Modeling of Chip-To-Package First-Level Interconnections
KW  - Rigorous Dynamic Model
KW  - Modeling
KW  - Chip-To-Chip Interconnects
ER  -