Sasaki, Shin-Ichi Ohsaki, Takaaki <br/><br/>
3-D Electromagnetic Field Analysis of Interconnections in Copper-Polyimide Multichip Modules 

 - 755-760 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electromagnetic Fields<br/>Interconnections<br/>Copper-Polyimide