Tseng, K F Hsion, Y H <br/><br/>
A Multifunctional Test Chip  for  Microelectronic Packaging and Its Application on Rf Property Measurements 

 - 633-643 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Multifunctional Test Chip<br/>Rlc Measurement<br/>Inductance