lin, Kwang -Lung Chao, Wen-Hsiuan <br/><br/>
Material Interactions of Solder Bumps Produced with  Fluxless Wave Soldering 

 - 59-64 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Diffusion<br/>Solder Bump Radius<br/>Wave Setup