Saitoh, Takehiro Toya, Masayuki <br/><br/>
Numerical Stress Analysis of Resin Cracking in Lsi Plastic Packages Under Temperature Cyclic Loading. II. Using Alioy 42 as Leadframe Material 

 - 176-183 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Delamination<br/>Finite - Element Analysis<br/>Fracture