Nawa, Kazunari Ueda, Sakae Watanabe, Hideyuki <br/><br/>
Advanced Copna-Resin as a Low Temperature Curing Resin  for  High-Density Electronic Packages 

 - 585-892 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Mcm<br/>Smali Worlds<br/>Low Temperature