Ulrich, Richard K. Rajan, Sanjay <br/><br/>
Substrate Temperatures of liquid Nitrogen Cooled Multichip Modules Utlizing Wirebonded Die 

 - 827-834 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Superconductor<br/>Mcm<br/>Thermal Management