Lee, Tien-Yu Lee, Taek Jung Tu, King-Ning <br/><br/>
A Study  of Electromigration in 3-D Flip Chip Solder Joint Using Numerical Simulation of Heat Flux and Current Density 

 - 472-479 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Computation Fluid Dynamics<br/>Current Density<br/>Flip-Chip