TY  - SER
AU  - Jang, Kyung-Woon
AU  - Kwon, Woon-Seong
TI  - Effects of Silica Filier and Diuent on Material Properties and Reliability of Nonconductive Pastes (Ncps)  for  Flip-Chip Applications
KW  - Diluent
KW  - Filier Size
KW  - Thermal Cycle Stability
ER  -