Chang, Rong-Chong Yang, Wen-Hsien <br/><br/>
Three-Dimensional Modeling of Mold Fililng in Microelectronics Encapsulation Process 

 - 200-209 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Finite Volume<br/>Ic Packages<br/>Vof