liu, Johan Malmodin, Jens Lai, Zonghe <br/><br/>
A Reliable and Environmentaliy Friendly Packaging Technology Flip Chip Joining Using Anisotropicaliy Conductive Adhesive 

 - 186-190 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Anisotropicaliy Conductive Adhesive Film<br/>Flip Chip<br/>Reliability