Shi, S. H. Wong, C. P. <br/><br/>
Study OfFluxing Agent Effects onProerties of No-Flow Underfili Materials  for  Flip-Chip Applications 

 - 141-151 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Catalyst<br/>Epoxy<br/>Flip-Chip