TY  - SER
AU  - Yu, D.Q.
TI  - Interfacial Metaliurgical Reaction Between Smali Flip-Chip Sn/Au Bumps and Thin Au/Tiw Metalilzation Under Multiple Reflow
KW  - Flip Chip
KW  - Soldering Error
KW  - Intermetalilc Compound
ER  -